Dear Sir or Madam:
Hope everything goes well with you and your business!
We would like to inform you that in coming Tokyo International Packaging Exhibition 2018
which hold on the Tokyo ,our booth No is as follows:
THEME:Tokyo International Packaging Exhibition 2018
|COMPANY NAME||SHENZHEN XUNLAN TECHNOLOGY.,LTD|
|FAIR BOOTH NO||2-C34|
|SHOW TIME||2 October-5 October 2018|
|FAIR ADD||3-10-1，Ariake,Koto-Ku,Tokyo 135-0063,Japan|
|NAME OF FAIR||Tokyo International Exhibition Center|
You are welcome to our booth room to negotiate business,
our main product is bubble envelopes and anti-static shielding bags ,
we have a long experience in production and have a great advantage in quality and price.
The size and color of the product according to your needs to product,
delivery can within 15 days after confirming the order.
we will give you our best service.
if you need more information about the product, we can email you.
Thanks for your kind attention and hope to see you soon.
Contact Person: Miss. Rita huang
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